Technical Seminar: The Future of Data Center Electrification
 


Date, time & venue

2022-12-21;6:30 - 8:00 pm;Chan Yat Mei Sophie Room – 9/F

Technical Seminar: 

The Future of Data Center Electrification

 

Jointly organized by MMNC, EL and AMC

 

Date, time & venue

21 December 2022 (Wednesday), 6:30-8:00 pm, HKIE- Chan Yat Mei Sophie Room 


Programme Highlight

Growth of modern technologies such as IoT, Industry 4.0, Big Data, AI, cloud computing is driving the huge growth of data center industry. Number of hyperscale data centers is increasing rapidly, from 338 in 2016 to 628 in 2021. The projected growth of the data center segment in the next 5 years is 4%. To allow this huge growth of data centers without great impact on environment, energy efficiency must increase.

 

The future of Data Center electrification should start from the design stage to optimize power usage, increase energy savings and reduce the Total Cost of Ownership (TCO) while maintaining high availability, reliability and security during the facility's operation.

 

We will highlight technologies you can leverage to lower your footprint, like the industry's most efficient digital solution from LV to MV with compact ATS, Modular UPS system and eco-friendly Gas Insulated Switchgear (GIS).

 

Space Planning and Optimizing power usage effectiveness (PUE) in Hyperscale Data Centers development in High Rise Building. 

 


Language

PowerPoint in English and Presentation in Cantonese

 

 

Registration & Enquiries

This seminar is free of charge and prior registration is required. The number of participants is limited to 55 (Seminar at HKIE HQ) and 300 (Webinar via Zoom) respectively. Applications will be accepted on a first-come-first-served basis with priority given to members of MMNC, AMC and EL Division. Only on-line registration via https://forms.gle/rWV1V7sEUm2WUezN9 shall be accepted for registration. Attendance certificates will be issued after the event. For enquiries, please contact Ir. Brian Yip at email: brianyip0608@gmail.com.





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